r/baba
Huawei claims it will make cutting-edge semiconductors by 2031
Huawei claims it will produce cutting-edge semiconductors by 2031, signaling China's long-term tech self-reliance.
- China's push for semiconductor self-reliance could strengthen the domestic tech ecosystem.
- Long-term independence in cutting-edge chips may reduce reliance on foreign suppliers.
- A 2031 timeline is too far out to provide any near-term catalyst for investors.
- Strict US sanctions could still hinder the actual realization of these advanced manufacturing goals.
Did people still remember how 5G worked for Huawei.
Which is?
Huawei dominated 5G on tech including building, using and patent. That’s why US stopped using it and saying it is wasting resource and claim it can skip to 6G directly.
Had more to do with the Chinese government was using Huawei tech to spy on other countries than the nonsense you said.
They are probably doing something via microfluidics to lower the power dissipation.
Instead of focusing on smaller tech nodes they are doing a system packaging approach. They are layering silicon die on top of each other and routing them to prevent high parasitic capacitance and resistance.
The issue is that this makes manufacturing very difficult, harder to validate and you suffer power impact and timing delays.
Also judging by the roadmap they will probably have some working euv by 2030 but the yield will probably be bad. Thus they are doing this chiplet layer approach so that even bad yield can be used. If you design for redundancy you can still user a wafer with bad yield if you plan on connecting them in super node or die stacking.
I've only ever heard of logic to inter-poser routing and not have "logic on logic" routing.
Inter-poser just have metal layers for signal routing/wiring (not transistors logic for switching).
Logic on logic how do you cool it, the heat must go somewhere?
Logic on logic was used due to heat. We use this all the time for memory because heat wasn't that much of an issue.
The innovation Huawei is not showing is probably from microfluidics to lower the heat. And innovation their manufacting step to combine logic layers together.
https://blog.darwin-microfluidics.com/glossary/microfluidic-cooling-microfluidics-explained/
These topics have been in research for years but the large semiconductor companies didn't want to invest in their implementation because they could just rely on logic scaling. Relying on it was dumb because there's a limit to how much you can keep shrinking until it's economically infeasible.
HSTech up except BABA what's going on