Samsung Validates Hybrid Bonding’s Clear Advantage in HBM4E Thermals

A Korean tech news outlet (ET news) published the article today, June 25, 2026, reporting that Samsung had published their research (an IEEE paper titled “Analysis of System-Level Thermal Characteristics of Hybrid Cu-Bonded HBM with 2.5D Advanced Packaging”) showing the thermal management advantages of their Hybrid Copper Bonding (HCB) technology over traditional Thermo Compression Bonding (TCB) for next gen HBM4E memory.

Samsung’s HBM4E and hybrid bonding plans already existed with HBM4E and Hybrid Copper Bonding (HCB) tech showcased at Nvidia GTC in March 2026, but this system-level thermal validation from the IEEE paper is new and exciting to me. In the IEEE study, they used multi-scale modeling and test chips in server-like conditions. They showed clear benefits like lower hotspot temperatures, reduced thermal interference between memory stacks and logic, more than 15% thinner stacks, and better power budgets for 16+ layers of HBM. This supports higher power budgets and reliability in servers under air-cooling conditions.

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Infographic explaining Samsung's Hybrid Copper Bonding \(HCB \/ hybrid bonding\) advantages for HBM4E. Made by Nanobanana

The broader trend I’ve noticed in the industry is a gradual shift toward hybrid bonding (direct Copper-to-Copper and dielectric bonding, DBI for short) for advanced packaging in HBM, chiplets, and 3D integration (HBM-on-GPU). It replaces or augments traditional thermo-compression bonding (TCB) / micro-bumps for finer pitches, better thermal & electrical performance, and thinner stacks. Major players like Samsung, SK hynix, TSMC, Intel, and Micron, are advancing this. In my opinion a the true winner agnostic beneficiaries of this are companies that provide equipment, metrology, IP, testing, and specialty manufacturing.

I’ve owned and continue to own $ONTO, $COHU, and $RMBS, specifically to get exposure to the Hybrid Bonding supply chain. All these stocks have more than doubled for me and I believe this theme/narrative is just starting to develop. There is another angle that seems very attractive to me right now.